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To investigate the influences of environmental stresses on board‐embedded polymeric waveguides.

Optical multimode waveguides were embedded on printed circuit boards using commercial polymers. The optical‐PCBs varying in board structure and in optical build‐up materials were exposed to heat, moisture and ionic‐contaminants in accelerated reliability tests. The influence of stress factors on the structural integrity and functional parameters, namely the refractive index and optical transmissivity, was investigated at the key communication wavelengths.

Isothermal annealing reduced the refractive index to the greatest extent. The optical‐PCB structure with an optical surface build‐up layer was observed to be more vulnerable under temperature shock when compared with the optical‐PCB with optical inner layer. The buffer layer beneath the optical build‐up was found to improve the stability of the optical waveguides significantly. The results indicated of wavelength dependence to the aging factor with a failure mechanism. The factors affecting the performance and reliability of polymer‐based optical waveguides on PCBs were discussed.

More experimental data and investigations of failure mechanisms are required to ultimately obtain sufficient reliability statistics for accurate life‐time prediction models.

Optical interconnects are seen as a promising solution to overcome performance limitations encountered with high‐frequency electrical interconnections. As an emerging technology, only a limited amount of reliability data on optical/electrical packages is available. The paper investigates the influences of environmental stresses on board‐embedded polymeric waveguides.

The purpose of this paper is to study fabrication of optical‐PCBs on panel scale boards in a conventional modern PCB process environment. It evaluates impacts on board design and manufacturing with the developed optical board verifiers outlining challenges and requirements for manufacturing low‐loss waveguide structures and optical building blocks. The study aims to expand the current knowledge in the field by adding results obtained by utilizing industrial production infrastructure and developed scalable manufacturing processes to fabricate optical‐PCBs and board assemblies in high‐volumes and low‐cost manner.

Impacts on board design and manufacturing were studied with the developed optical technology verifiers. One verifier is optical‐PCB with embedded waveguides, integrated i/o couplers and optical vias. Another verifier is large size PCB with optical layer. A system‐level optical board assembly with 12.5 Gb/s Tx/Rx devices on surface mounted ball grid array (BGA) modules is designed for optical link analysis. Fabricated optical structures on verifiers are evaluated of their physical characteristics utilizing optical, SEM, LSCM analysis methods. Performance testing is conducted using standard optical transmission measurement methods and equipment.

The paper provides empirical results about fabrication of multimode optical waveguides with conventional PCB process equipment. Results suggest that current coating and imaging equipments are capable of producing optical waveguide patterns with high resolution and size accuracy. However, fabricators would require larger process window and defect tolerance for processing optical materials to obtain low‐loss waveguides with sufficient yields.

Because of the limited amount of design variants in production verifiers evaluated in this paper, some impacts like effect of base material, board construction, optical layer location and beam coupling solution were not evaluated. Likewise, impacts on long‐term stability and cost were not addressed. These factors however require further investigation to address technical feasibility of optical PCBs technology prior commercial high volume production.

The paper includes implications for the development of a fabrication methods and testing procedures for optical polymer waveguide layers on PCBs.

This paper fulfils need to provide results on design, fabrication and characterization of optical PCBs and backplanes from industrial fabricator's perspective. The paper provides input for end‐user and developers to evaluate technical performance, robustness, and maturity of building blocks and supply chain to support polymer waveguide based technology for intra‐system optical links.